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ITSLC 2020

The International Workshop on Intelligent Technologies for Subspace Learning and Clustering of High-dimensional Data (ITSLC 2020)

Intelligent-based clustering analytics and subspace learning are fundamental hot topics in signal processing, pattern recognition, computer vision, machine learning, etc. These intelligent analytics techniques provide suitable frameworks for many applications and are crucial for downstream high level decision. Even if considerable progress has been made over the past decades, there are still main challenges that concern the algorithm scalability, robustness, data heterogeneous, etc. Recently, the deep learning and optimization becomes significant and popular tools used to guide the intelligent data clustering and learning by well-designed models for low-dimensional embedding, similarity metric, discriminative analysis , graph learning and so on. Meanwhile, many Intelligent computing-based clustering and learning algorithms are proposed progressively for data pattern analytics. Nevertheless, for high-dimensional data, there are more valuable and challenging problems to be studied in the above mentioned tasks, which will help to further technology development and wide applications. Furthermore, recent advances in deep learning give promising gap of performance.

Topics include, but are not limited to:

Robust subspace learning
Unsupervised representation learning
Deep Auto-Encoders
Robust subspace clustering
Robust low rank factorization
Novel theory for discriminative strategy designing for high-dimensional data
Novel spectral clustering algorithm for high-dimensional data
Similar graph learning
Manifold learning transfer learning
Feature extraction and dimension reduction for high-dimensional data
Multi-modal data analysis
Multi-view learning

The workshop organizers cordially invite submissions of original research work to The International Workshop on Intelligent Technologies for Subspace Learning and Clustering of High-dimensional Data (ITSLC 2020), in conjunction with The 13th EAI International Conference on Mobile Multimedia Communications, to be held on July 22-23, 2020 in Harbin, China. Paper formatting instructions can be found here. Please note that paper length is 4-6 pages, and the review process will be single blind.

Workshop Organizers

Important Dates

Workshop: TBA (one of the MOBIMEDIA 2020 conference days)
Location: Harbin, China (venue to be announced)
Paper Due: February 27, 2020
Paper Notification: April 15, 2020
Camera-ready Paper Due: May 15, 2020
Start of MobiMedia Conference: July 22, 2020
End of MobiMedia Conference: June 23, 2020

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